| abstract |
The present invention provides a conductive adhesive composition that has excellent adhesiveness and low surface resistance and can be used as a buffer layer of an electronic device. The conductive adhesive composition of the present invention comprises (A) a water-soluble polyvinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, and (B) the organic additive is water-soluble. It is at least one selected from polyhydric alcohols, water-soluble pyrrolidones or hydrophilic aprotic solvents, and (C) the conductive organic polymer compound is selected from polyanilines, polypyrroles or polythiophenes, and derivatives thereof It is characterized by being at least one kind. The present invention also provides an electronic device having a conductive layer made of the conductive adhesive composition, an anode laminate in which a conductive layer made of the conductive adhesive composition is laminated, and a method for manufacturing the electronic device. Is done. |