abstract |
According to the present invention, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a copolymer of 1-alkene having 5 to 80 carbon atoms and maleic anhydride, Provided is an epoxy resin composition for encapsulating a semiconductor comprising a compound esterified with an alcohol having 5 to 25 carbon atoms in the presence of a compound represented by the formula (1), wherein in the general formula (1), R 1 Is selected from the group consisting of an alkyl group having 1 to 5 carbon atoms, a halogenated alkyl group having 1 to 5 carbon atoms, and an aromatic group having 6 to 10 carbon atoms. |