| abstract |
[Problem] To provide an electronic component with a built-in board and a component-embedded board with a reduced thickness, and contribute to reducing the size and weight of electronic devices. [Solution] A substrate built-in electronic component (110) having a planar coil (110, 111) protected by an insulator (103-105) sandwiched between a pair of magnetic layers (101, 102). 100) includes holes (106 to 109) or openings or defects formed at predetermined positions in one or both of the pair of magnetic layers (101, 102), and the predetermined position is the planar coil. It is a position facing the terminal electrodes (112 to 115) of (110, 111). |