| abstract |
Provided is a curable composition capable of obtaining a cured resin which is not easily yellowed even under high temperature conditions such as soldering by a reflow method. The curable composition of the present invention comprises a cationically polymerizable compound and at least one organic sulfur compound selected from a thiol compound, a dithiol compound, a sulfide compound, and a disulfide compound. As said organic sulfur compound, the compound whose boiling point is 100 degreeC or more is preferable. The cationic polymerizable compound is preferably at least one compound selected from an epoxy compound, an oxetane compound, and a vinyl ether compound. |