http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011077973-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2010-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2011077973-A1 |
| titleOfInvention | Abrasive for polishing copper and polishing method using the same |
| abstract | The abrasive for polishing copper according to the present invention is at least one smoothing selected from the group consisting of tetrazole, tetrazole derivatives, triazoles and triazole derivatives (excluding benzotriazole and benzotriazole derivatives). Agent, inorganic acid, amino acid, protective film forming agent, abrasive grains, oxidizing agent, and water, the content of inorganic acid is 0.080 mol / kg or more, and the content of amino acid is 0 200 mol / kg or more, the content of the protective film forming agent is 0.020 mol / kg or more, and the ratio of the content of the inorganic acid to the content of the protective film forming agent is 3.0 or more. |
| priorityDate | 2009-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 120.