| abstract |
Provided is a solder resist composition capable of forming a solder resist excellent in flame retardancy, low elasticity, high elongation and folding resistance in addition to adhesion to a substrate, low warpage and solder heat resistance. (A) containing a carboxyl group-containing photosensitive resin, (B) an acrylated urethane resin, (C) a photopolymerization initiator, (D) a diluent, (E) an epoxy compound, and (F) a phosphorus element-containing organic filler. It is a flame-retardant solder resist composition characterized. |