| abstract |
An element housing package 1 having a substrate 3 having a mounting region R of the element 2 on its upper surface and a frame provided on the substrate 3 along the outer periphery of the mounting region R and partially having a through hole H 4 is provided. Further, the element storage package 1 is provided in the through hole H and extends to the inside and outside of the frame body 4, and the inside and outside of the frame body 4 formed on the first dielectric layer 7. The signal line 8 to be electrically connected, the first ground layer 9 a formed on the lower surface of the first dielectric layer 7, and a region that overlaps the frame body 4 in a plan view and is formed on the signal line 8. The second dielectric layer 10, the second ground layer 9 b formed on the upper surface of the second dielectric layer 10, and the frame body 4 from the frame body 4 along the signal line 8 provided in the second dielectric layer 10. 4 includes an input / output terminal 5 having a metal layer 11 extending to the outside. The metal layer 11 is formed from the second dielectric layer 10 to the first dielectric layer 7 so as to be connected to both, and is provided apart from the signal line 8. |