| abstract |
Provided is a thermosetting composition for a protective film of a wiring board which is excellent in low warpage, flexibility and long-term electrical insulation reliability. The thermosetting composition for a protective film of a wiring board of the present invention has an epoxy group-containing compound having a tricyclodecane structure, a functional group capable of reacting with an epoxy group, and a structural unit represented by the formula (1) A polyurethane and a solvent are essential components. (In the formula, R 1 represents an alkylene group having 3 to 18 carbon atoms, and n represents an integer of 1 or more.) As the epoxy group-containing compound having a tricyclodecane structure, a compound of the formula (2) is preferably used. |