http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010122995-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0647 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 |
| filingDate | 2010-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2010122995-A1 |
| titleOfInvention | Imidazole compound-containing microencapsulated composition, curable composition using the same, and masterbatch type curing agent |
| abstract | A composition that, when used as a curing agent for an epoxy resin, has excellent low-temperature curability, high storage stability, and also achieves high solvent stability, a curing agent for an epoxy resin using the composition, and To provide an epoxy resin composition. An imidazole containing a core containing an imidazole compound represented by the following formula (1) and a shell containing an organic polymer, an inorganic compound, or both, and covering the surface of the core. Compound-containing microencapsulated composition. (Wherein R 1 , R 2 and R 3 each independently represents a hydrogen atom, a halogen group, an alkyl group having 1 to 20 carbon atoms which may contain a substituent, an aromatic group which may contain a substituent, An alkoxy group having 1 to 20 carbon atoms which may contain a substituent, or a phenoxy group which may contain a substituent, Q represents a divalent hydrocarbon having 1 to 20 carbon atoms which may contain a substituent. m represents an integer of 1 to 100. Z represents an organic group having a valence m. Y represents a urea bond, a thiourea bond, an amide bond, or a thioamide bond represented by the following formula (G). To express.) |
| priorityDate | 2009-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 624.