| abstract |
(A) water, (B) a water-soluble polymer compound having an oxygen-containing group and a number average molecular weight of 6,000 to 3,000,000, and (C) a cloud point in a 1 mass% aqueous solution of 10 to 70 ° C. The processing fluid for brittle materials and the processing fluid for hard materials, which are blended with a nonionic surfactant of the above, and in the free abrasive method, the slurry can be sufficiently supplied to the processing gap, and the abrasive dispersion stability can be improved. In addition to excellent chip cleaning and dispersibility, on the other hand, in the method using a fixed abrasive wire saw, fixed abrasive grains are difficult to peel off, and chip cleaning and dispersibility are excellent, and water-containing processing for brittle materials and hard materials Provide liquid. |