| abstract |
Provided is a resin paste for die bonding that is excellent in adhesive strength with a chip in a wide temperature range in the B-stage, can reduce voids between the chips, and has excellent die shear strength during heating even in a solder reflow process. A resin paste for die bonding containing a polymer (A), a thermosetting resin (B), and a filler (C) obtained by reacting a carboxyl group-containing butadiene polymer (a1) and an epoxy group-containing compound (a2). is there. |