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filingDate 2010-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2012-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2010095367-A1
titleOfInvention Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and manufacturing method of vacuum sealed package
abstract A package main body part in which the first main body part and the second main body part are joined via the hollow part, and a getter material and an electronic device provided in the hollow part, and the inside and the outside of the hollow part are connected to each other. A vacuum sealed package for sealing a package body with a sealing member in a state where a hollow portion is evacuated through a through-hole to be communicated, wherein the getter material and the electronic device include a first conductor pad and a second conductive device. The first conductor pad is connected to the third conductor pad via the heat conductive material, and the second conductor pad is electrically connected to the fourth conductor pad on the wiring board. Is done.
priorityDate 2009-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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