| abstract |
The LED light-emitting electronic component uses a SUS lead frame and has a die bonding frame 65 and a wire bonding frame 64. The die bonding frame 65 includes a horizontal portion 63 and a die bonding portion 67 which is located below the horizontal portion 63 in a stepped shape and is formed in a concave shape or a cup shape by drawing. The wire bonding frame 64 is positioned at the same height as the horizontal portion 63, and is separated from the die bonding portion 67 in an electrically nonconductive state by a gap 68. The bonding region of the wire bonding frame 64 is disposed at a position higher than the light emitting surface of the LED chip 62. On the upper surface of the wire bonding frame 64, a silver base layer 69 formed by firing a composite silver nanoparticle layer is provided. Between the upper surface electrode of the LED chip 62 and the silver base layer 69, wire bonding 70 using a gold wire is performed. |