| abstract |
There is provided a manufacturing method capable of sufficiently evaluating the reliability of an electronic component and enhancing the reliability of an electronic device in which the electronic component is joined to another electronic component via a solder bump. A first component and a second component are prepared, and a first bump made of a first solder based on Bi is formed on one of the first component and the second component. On the other of the second parts, a second bump made of a second solder based on Sn and having a liquidus temperature substantially the same as that of the first solder is formed, and the liquid of the first solder and the second solder is formed. By contacting the first bump and the second bump at a temperature higher than the phase line temperature, the first bump and the second bump are integrated and the liquidus temperature is lower than that of the first solder and the second solder. A method for manufacturing an electronic device, comprising: forming a solder joint portion made of three solders between a first component and a second component; and lowering the temperature of the solder joint portion to solidify the solder joint portion. [Selection] Figure 1 |