http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010038668-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
| filingDate | 2009-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2010038668-A1 |
| titleOfInvention | Flux composition and solder paste composition |
| abstract | In order to obtain a soldering flux with good coating / printability and solderability without causing a change in viscosity over time or “skin burr” and “buzziness”, and solder paste using this, As a component of the flux, a resin, a thixotropic agent, an activator, a solvent, and a glucopyranosylamine type nanotube are included. It is preferable that the solder powder used for the solder paste does not contain lead or a lead alloy and contains Sn—Cu—Ni or Sn—Ag—Cu as a main component. |
| priorityDate | 2008-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.