http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010038532-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2009-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2010038532-A1 |
| titleOfInvention | Multilayer printed wiring board and method for producing multilayer printed wiring board |
| abstract | The multilayer printed wiring board of the present invention includes a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, for mounting an electronic component, the first interlayer resin insulation layer, and the pad. A multilayer printed wiring board comprising: a solder resist layer having an opening reaching the pad; and a protective film located on the bottom of the opening and formed on the pad. A metal layer containing at least one metal selected from the group consisting of Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt, and Au is formed on the surface of the pad, and a coupling agent is formed on the metal layer. And at least a part of the protective film is formed directly on the exposed surface of the pad exposed by the opening. |
| priorityDate | 2008-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.