| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2009-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2010035445-A1 |
| titleOfInvention |
Laminate board, circuit board and semiconductor device |
| abstract |
The laminate of the present invention is a laminate comprising an insulating resin layer and a metal foil in contact with the insulating resin layer, wherein the metal foil has a tensile elastic modulus (A) at 25 ° C. of 30 GPa or more and 60 GPa or less. The thermal expansion coefficient (B) of the resin layer is 10 ppm or more and 30 ppm or less, the flexural modulus (C) of the insulating resin layer at 25 ° C. is 20 GPa or more and 35 GPa or less, and the thermal expansion coefficient in the XY direction at 25 ° C. to Tg of the insulating resin layer. When (D) is 5 ppm or more and 15 ppm or less, The laminated board whose interface stress between the insulating resin layer represented by following formula (1) and metal foil is 7x10 < 4 > or less. Interfacial stress = {(B)-(D)} x {(A)-(C)} x {Tg−25 [° C.]} (1) Tg: represents the glass transition temperature of the insulating resin layer. |
| priorityDate |
2008-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |