http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010032854-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0221 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16 |
| filingDate | 2009-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2010032854-A1 |
| titleOfInvention | Conductive fine particles and anisotropic conductive material using the same |
| abstract | The conventional conductive metal layer application process can be greatly simplified, and at the same time, the surface of the base particles can be uniformly coated with the conductive layer, and the adhesion between the base particles and the conductive metal layer is excellent. Provided are conductive fine particles with extremely few defects such as cracks in the conductive metal layer and anisotropic conductive materials using the conductive fine particles. M / C (atomic ratio, M represents the total number of atoms of alkali metal elements and nitrogen elements) of the base material particles after sodium adsorption treatment measured by X-ray photoelectron spectroscopy (ESCA) is 0 .5 × 10 −2 or more and a degree of hydrophobicity of less than 2% and base particles made of a vinyl polymer having a mass average particle diameter of 1000 μm or less, and a conductive metal layer covering the surface of the base particles The conductive fine particles are obtained by forming a conductive metal layer on the surface of the substrate particles by an electroless plating method. |
| priorityDate | 2008-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 242.