http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010007859-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2009-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2010007859-A1 |
| titleOfInvention | Epoxy resin composition, cured product thereof, method for producing cured product, optical semiconductor sealing material, and optical semiconductor device |
| abstract | Provided is an epoxy resin composition that is excellent in fluidity in a varnish state, is excellent in heat-resistant yellowing after heat history of a cured product, and further exhibits excellent performance in cured product strength. Epoxy equivalent 150-500 g / eq. Bisphenol type epoxy resin or epoxy resin represented by epoxy resin having cycloaliphatic structure (A), methacrylic acid (B), acid group-containing radical polymerizable monomer having aliphatic ester bond or aliphatic carbonate bond (C) and radical polymerization initiator (D) are essential components. |
| priorityDate | 2008-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 349.