http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009151012-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0751 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
| filingDate | 2009-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009151012-A1 |
| titleOfInvention | Polyamide resin, photosensitive resin composition, method for forming cured relief pattern, and semiconductor device |
| abstract | Provided are a photosensitive resin composition that is excellent in photosensitive characteristics and provides excellent film characteristics even when a resin film is formed under a heat curing condition such as 200 ° C. or less, and a polyamide resin used in the photosensitive resin composition. The present invention provides the following formula (1): {Wherein X is a trivalent organic group having 6 to 15 carbon atoms, m is 0 or 2, and Y is a divalent organic group having 6 to 35 carbon atoms when m = 0, When m = 2, it is a tetravalent organic group having 6 to 35 carbon atoms, and R 1 is a radically polymerizable unsaturated bond group having 5 to 20 carbon atoms, which may contain atoms other than carbon. It is an aliphatic group having at least one. Are included so that the number of repetitions is in the range of 2 to 150 and the number of repetitions is in the range of 80 to 100% of the total number of all the structural units constituting the polyamide resin. provide. |
| priorityDate | 2008-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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