http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009142126-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate | 2009-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009142126-A1 |
| titleOfInvention | Catalyst application liquid for solder plating |
| abstract | When performing electroless reduction solder plating directly on a copper-based conductor circuit material, it is possible to obtain a uniform film without unevenness in film thickness, and to provide a catalyst that can form a solder plating film with no fine wiring bridges And a catalyst-providing solution for performing electroless reduction solder plating on a copper-based metal, which is a water-soluble solution. This problem has been solved by a catalyst-imparting solution containing a gold compound and a chelating agent. Also, a solder plating film on a copper-based metal obtained by electroless reduction solder plating using the catalyst-providing liquid, 3 × 10 −5 g / cm 2 or less on the copper-based metal This problem was solved by a solder plating film formed on the gold. |
| priorityDate | 2008-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.