http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009123058-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009123058-A1 |
| titleOfInvention | Epoxy resin composition and molded article |
| abstract | Provided is an epoxy resin composition having excellent moldability, high thermal conductivity when combined with an inorganic filler, and a cured product having low thermal expansion and excellent heat resistance and moisture resistance. This epoxy resin composition includes (A) an epoxy resin and (B) a curing agent, 50 wt% or more of the epoxy resin is 4,4′-benzophenone-based epoxy resin, and 50 wt% or more of the curing agent is 4,4 ′. -A benzophenone-based phenolic resin, an epoxy resin composition having an equivalent ratio of epoxy groups in the epoxy resin and functional groups in the curing agent in the range of 0.8 to 1.5. This epoxy resin composition can contain 50 to 95 wt% of an inorganic filler and is suitable for semiconductor encapsulation. |
| priorityDate | 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 200.