| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-102 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2008-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2009054343-A1 |
| titleOfInvention |
Copper wiring pattern forming method and copper oxide particle dispersion used therefor |
| abstract |
Low resistance copper wiring using copper particles with little electromigration and low unit price of the material itself, using almost no surface treatment agent essential for oxidation resistance and dispersion of copper particles, and suppressing the occurrence of cracks A pattern forming method and a copper oxide particle dispersion used therefor are provided. A step of forming an arbitrary pattern using a dispersion liquid in which copper-based particles having a copper oxide surface are dispersed on a substrate, and copper oxide on the surface of the copper-based particles in the pattern is reduced to atomic copper by atomic hydrogen. And a step of sintering the copper metal particles produced by reduction and reduction. |
| priorityDate |
2007-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |