http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009028493-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2008-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009028493-A1 |
| titleOfInvention | Insulating resin composition for multilayer printed wiring board, insulating resin sheet with substrate, multilayer printed wiring board and semiconductor device |
| abstract | Insulating resin composition for multilayer printed wiring board excellent in desmear property in multilayer printed wiring board production process, and insulating resin sheet with substrate, and thermal shock using the insulating resin composition for printed wiring board It is intended to provide a multilayer printed wiring board and a semiconductor device which are excellent in reliability such as heat resistance and moisture absorption solder heat resistance. (A) Aminosilane coupling agent, (B) Silica having an average particle size of 2.0 μm or less, (C) Epoxy resin, (D) Phenoxy resin as essential components, and (C) Epoxy resin as 14 of the resin composition The linear thermal expansion coefficient of the cured product of the resin composition is 35 ppm or less in the range of 25 ° C. to 150 ° C., and the glass transition temperature (Tg) is 190 ° C. or less. The resin composition has a minimum dynamic viscosity of 2000 Pa · s or less. |
| priorityDate | 2007-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 117.