http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009014191-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2008-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009014191-A1 |
| titleOfInvention | Polishing composition |
| abstract | An object of the present invention is to provide a polishing composition capable of achieving a high polishing rate and improving flatness. The polishing composition of the present invention is a polishing composition suitable for a metal film, particularly a copper (Cu) film, and includes a basic compound containing an ammonium group, an alkylbenzene sulfonate having an alkyl group having 9 to 18 carbon atoms, and Contains hydrogen peroxide, the balance being water. As the basic compound, ammonium hydroxide can be used, and as the alkylbenzene sulfonate, dodecylbenzene sulfonate can be used. |
| priorityDate | 2007-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.