http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009013947-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-2081 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-083 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P1-36 |
| filingDate | 2008-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009013947-A1 |
| titleOfInvention | Non-reciprocal circuit element |
| abstract | A nonreciprocal circuit device capable of improving the stability and reliability of solder connection between a terminal electrode of a circuit board and an electrode provided on a ferrite is obtained. A nonreciprocal circuit device comprising a permanent magnet, a ferrite to which a DC magnetic field is applied by the permanent magnet, first and second center electrodes disposed on the ferrite, and a circuit board (20). The connection electrodes provided on the ferrite are electrically connected to terminal electrodes (25a, 25b, 25c) formed on the circuit board (20) via solder. Solder flow preventing portions (27a, 27b) are formed on the terminal electrodes (25a, 25b) by laser irradiation. When the solder applied on the extension portions (25a ', 25b') of the terminal electrodes (25a, 25b) is melted, it is blocked by the prevention portions (27a, 27b), and the main body side of the terminal electrodes (25a, 25b) Will not be leaked. |
| priorityDate | 2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.