| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0218 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B17-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-00 |
| filingDate |
2008-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2010-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2009008383-A1 |
| titleOfInvention |
Conductive fine particles, anisotropic conductive material, and connection structure |
| abstract |
An object of this invention is to provide the electroconductive fine particles which can reduce a connection resistance value and can implement | achieve high connection reliability. Another object of the present invention is to provide an anisotropic conductive material and a connection structure using the conductive fine particles. The present invention provides a low melting point containing a metal layer containing nickel or palladium and at least one group 13 element selected from the group consisting of thallium, indium and gallium on the surface of resin fine particles. The conductive fine particles are sequentially laminated with a metal layer, and the content of the Group 13 element in the total amount of metals contained in the low-melting-point metal layer is 0.01 to 6% by weight. Conductive fine particles. |
| priorityDate |
2007-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |