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filingDate 2008-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2009008242-A1
titleOfInvention Curable resin composition
abstract The curable resin composition comprises a vinyl polymer (A) in which part or all of the constituent monomer units are (meth) acrylic acid ester units, a compound (B) having a carboxyl group having a molecular weight of 1000 or less, And an oxyalkylene polymer (C) having a decomposable silyl group. The oxyalkylene polymer (C) functions as a base resin, and the vinyl polymer (A) functions as a plasticizer. By including the compound (B) having a carboxyl group having a molecular weight of 1000 or less, the curing rate after a long period from the production can be made not much different from the curing rate immediately after the production. In this case, the compounding quantity of the compound (B) having the carboxyl group with respect to 100 parts by mass of the total of the vinyl polymer (A) and the oxyalkylene polymer (C) is 0.01 parts by mass or more and 10 parts by mass or less. Is preferred.
priorityDate 2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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