http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008132852-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67144 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2008-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008132852-A1 |
| titleOfInvention | Dicing die bonding tape and semiconductor chip manufacturing method |
| abstract | When the semiconductor wafer is diced and the semiconductor chip is picked up together with the die bonding film, a dicing die bonding tape is obtained which makes it possible to easily peel and remove the semiconductor chip together with the die bonding film. A dicing die bonding tape 1 used for dicing a semiconductor wafer to obtain a semiconductor chip and die bonding the semiconductor chip. The dicing die bonding tape 1 includes a die bonding film 3 and a die bonding film 3. The non-adhesive film 4 is attached to one surface, and the non-adhesive film 4 contains a (meth) acrylic resin crosslinked body as a main component. |
| priorityDate | 2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.