http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008129944-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate | 2008-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008129944-A1 |
| titleOfInvention | Etching solution |
| abstract | The present invention provides an etching solution capable of etching a silicon oxide film uniformly with little change in the chemical solution due to evaporation of the chemical solution and the like, less frequent chemical solution replacement, and less change in etching rate over time. . Specifically, an etching solution containing hydrofluoric acid (a), ammonium fluoride (b), and a salt (c) of hydrogen fluoride and a base having a boiling point higher than that of ammonia, ammonium fluoride (b ) Having a concentration of 8.2 mol / kg or less, and a total of ammonium fluoride (b), hydrogen fluoride, and a salt of a base having a boiling point higher than ammonia (c) is 9.5 mol / kg or more, The present invention relates to a manufacturing method and an etching method using the etching solution. |
| priorityDate | 2007-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.