http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008120764-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2008-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008120764-A1 |
| titleOfInvention | Polyamic acid resin composition, cured film and semiconductor device using the resin composition |
| abstract | The polyamic acid resin composition of the present invention is a resin composition containing a polyamic acid having an alkylene chain of 5 to 20 carbon atoms in the main chain, and is heat-cured at a temperature at which the imidization ratio is 80% or more. The resin composition cured film having a thickness of 20 μm has a tensile modulus of 100 or more and less than 1500 MPa. According to the present invention, a thick film can be formed (up to 200 μm) by one application (spin coating) while using a polyimide resin precursor (polyamic acid), and low temperature workability (up to 200 ° C.) can be achieved. It can be obtained from a polyamic acid resin composition suitable for use as a protective coating agent for a semiconductor substrate, and a cured film excellent in low warpage, heat resistance, insulation, and low water absorption. A semiconductor device having a cured film formed can be provided. |
| priorityDate | 2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 213.