abstract |
An epoxy resin, a triazine-modified novolak resin, and an inorganic filler, and the content of the triazine-modified novolak resin is 40 parts by weight or more and 70 parts by weight or less with respect to 100 parts by weight of the epoxy resin. Then, even when a stress is repeatedly applied to the solder connection portion due to heat and vibration, the solder portion does not crack. |