http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008108315-A1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L73-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-32
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 2008-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2008108315-A1
titleOfInvention Resin composition for heat resistant substrate, prepreg and heat resistant substrate
abstract An epoxy resin, a triazine-modified novolak resin, and an inorganic filler, and the content of the triazine-modified novolak resin is 40 parts by weight or more and 70 parts by weight or less with respect to 100 parts by weight of the epoxy resin. Then, even when a stress is repeatedly applied to the solder connection portion due to heat and vibration, the solder portion does not crack.
priorityDate 2007-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004002822-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005015510-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004059689-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007231246-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006037083-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006028298-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID123047
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556970
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419574667
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409010033
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10787
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524993
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419532622
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10687
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID947
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7064
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1057
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10949
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408799882
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559464
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID406907632
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7847
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474382
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456554079
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414871446
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12749
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6492

Total number of triples: 56.