http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008102795-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4635 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2008-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008102795-A1 |
| titleOfInvention | Flexible multilayer wiring board |
| abstract | An object of the present invention is to provide a flexible multilayer wiring board that can be easily reduced in thickness and has sufficient durability against repeated bending and thermal shock. A preferred flexible multilayer wiring board (100) includes a flexible inner layer substrate (10) having inner layer wires (4) formed on both sides of an insulating layer (2), and an outer layer disposed on at least one side of the inner layer substrate. A wiring (30) and an insulating adhesive sheet (20) interposed between the inner layer substrate and the outer layer wiring are provided. At least one of the insulating adhesive sheets is made of an imide group-containing polymer. |
| priorityDate | 2007-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.