| abstract |
Provided are a microchip manufacturing method and a microchip substrate bonding apparatus, in which an inner surface of a flow path is hydrophilized to prevent foreign substances from entering the flow path and excellent in bonding strength between substrates. For this purpose, the SiO 2 film 12 is formed on the surface of the microchip substrate 10 on which the microchannels 11 are formed under vacuum or reduced pressure or atmospheric pressure with a replacement gas, and the SiO 2 film 21 is formed on the surface of the microchip substrate 20. Form. Thereafter, the SiO 2 films 12 and 21 are activated, and the microchip substrates 10 and 20 are stacked and bonded with the surface on which the SiO 2 films 12 and 21 are formed facing inward. By forming the SiO 2 film, activating treatment, and bonding under a vacuum or atmospheric pressure with a replacement gas, foreign substances can be prevented from entering the flow path and the bonding surface, and the substrates can be firmly bonded to each other. Can be joined. |