abstract |
It is an electroconductive bump (17) formed in the electrode terminal (11) surface of an electronic component, Comprising: An electroconductive bump (17) is comprised with several resin hardened | cured material from which the density of an electroconductive filler differs at least. As a result, it is possible to prevent the occurrence of short circuits and poor connections due to the collapse of the conductive bumps (17) during mounting. |