http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008068996-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3878 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G85-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-348 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J165-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-668 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6659 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G85-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2007-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008068996-A1 |
| titleOfInvention | Oxetane-containing resin, adhesive and resist agent using the same |
| abstract | [PROBLEMS] To produce a laminate for use in automobile parts, electrical appliances, and textiles, especially for multilayer wiring boards and flat cables, and exhibits the fluidity necessary for adhesion at the time of bonding, but latent heat that is rapidly cured by heat and light. A thermosetting resin that is suitable for curable adhesives and has excellent solder heat resistance, a resin that exhibits excellent flame retardancy without using halogen, and that exhibits latent curability that rapidly cures by heat and light, and It is to provide an adhesive or a resist agent comprising the same. The number average molecular weight is 2000 or more, and one or more linking groups selected from an ester bond, a urethane bond, an amide bond or an ether bond in the main chain and an oxetane group in the molecule of 100 to 10,000 equivalents / ton. And an oxetane-containing resin having a carboxyl group of 300 to 5000 equivalent / ton, a phosphorus atom of 0.1 wt% or more, or an ethylenically unsaturated double bond of 100 to 2000 equivalent / ton , Adhesives and resists obtained therefrom. [Selection figure] None |
| priorityDate | 2006-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 156.