http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008053866-A1

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filingDate 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2008053866-A1
titleOfInvention Resin molding method and resin molding apparatus
abstract When the mold has an irregular shape and has an internal structure and a small space ratio, a function of uniformly injecting resin into the mold and molding can be provided. An apparatus provided with a container for putting a resin therein, the vacuum means capable of depressurizing the inside, a drying means capable of degassing the inside, and a heating means capable of melting the resin. The resin is melted at a temperature higher than the melting point, the inside is vacuum degassed by vacuum means and drying means, and then the pressure is returned to the standard pressure and the mold is placed on the surface of the resin. And is allowed to stand for a predetermined time to return the resin to a reference pressure in a molten state.
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Total number of triples: 29.