http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008050448-A1

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filingDate 2006-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2008050448-A1
titleOfInvention Electrical connection structure and first connection member used therefor
abstract Provided is an electrical connection structure (C) capable of realizing a low-profile and detachable connection portion. This electrical connection structure (C) A flexible insulating film (1), at least one conductive pad portion (2) formed on at least one side (1a) of the insulating film (1), and an edge portion of the pad portion (2) The conductor circuit pattern (3) drawn from the pad, the through hole (4) formed in the thickness direction of the insulating film (1) within the surface of the pad portion (2), and the pad communicating with the through hole (4) A flexible substrate having a small hole (5) formed in the surface of the part (2) is defined as a first connecting member (A), In the through hole (4) of the first connecting member (A), Conductive protrusions of the second connection member (B) in which conductive protrusions (7) electrically connected to the conductor circuit pattern (8) formed inside or on the surface (6a) are formed on at least one surface (6a). (7) is inserted into the small hole (5) of the pad portion (2), The pad portion (2) and the conductive protrusion (7) are in mechanical contact.
priorityDate 2006-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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