http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008023465-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0048 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 |
| filingDate | 2007-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008023465-A1 |
| titleOfInvention | Micro-electromechanical mechanism device and manufacturing method thereof |
| abstract | The present invention relates to a micro electro mechanical device having a simple configuration capable of reducing distortion of a semiconductor substrate. Both the semiconductor substrate 17 and the second substrate 14 are provided to face the one main surface 13 a of the first substrate 13, and are connected to the one main surface 13 a of the first substrate 13. As a result, the first substrate 13 does not require internal wiring and side wiring, and the configuration can be simplified. Also, the wiring length can be shortened to reduce resistance, and excellent electrical characteristics can be obtained with low power consumption. Further, the distortion of the semiconductor substrate 17 can be suppressed. |
| priorityDate | 2006-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.