http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008018399-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-123 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2007-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008018399-A1 |
| titleOfInvention | Method for modifying surface of polyimide resin layer and method for producing metal-clad laminate |
| abstract | The present invention relates to a surface treatment method for dramatically improving the adhesion of a polyimide resin layer by a simple surface treatment. According to this surface treatment method, the adhesive strength can be improved even in a low-roughness copper foil suitable for fine pitch formation. Therefore, a metal-clad laminate used for high-density printed wiring boards and HDD suspension boards can be obtained. Obtainable. This surface treatment includes: a) a step of forming a plasma treatment layer surface by plasma-treating a surface layer of the polyimide resin layer; and b) drying and heat treatment after applying a polar solvent solution containing an amino compound to the plasma treatment layer surface. And forming a surface modification layer. The polyimide resin layer having a modified layer on the surface obtained by this surface treatment is suitable for obtaining a metal-clad laminate for a wiring board by forming a metal layer on this surface by thermocompression bonding or vapor deposition. |
| priorityDate | 2006-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 408.