http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008007551-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-7657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-3243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1064 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-45 |
| filingDate | 2007-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008007551-A1 |
| titleOfInvention | Method for forming piezoelectric synthetic resin film |
| abstract | It is an object of the present invention to provide a method for forming a piezoelectric synthetic resin film that can be produced at low cost. Specifically, the present invention provides a method for forming a piezoelectric synthetic resin film that can reduce the manufacturing cost and can form a piezoelectric synthetic resin film, particularly a large-area piezoelectric resin film, with a small capital investment. The method for forming this piezoelectric synthetic resin film is such that a raw material monomer for synthesizing a resin having a polar group containing at least one bond selected from a urea bond, an ester bond, an amide bond and an imide bond has a reaction temperature condition of 5 ° C. or higher. , Synthesized in advance as a resin having a degree of polymerization of 4 or more and 300 or less at 60 ° C. or less, and then applying the pre-synthesized resin on a substrate and performing the pre-synthesis while performing polarization treatment at 70 ° C. or more and 250 ° C. or less. The obtained resin is polymerized to form a piezoelectric synthetic resin film on the substrate. |
| priorityDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 147.