http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008004520-A1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-12 |
filingDate | 2007-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2009-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2008004520-A1 |
titleOfInvention | Method for modifying surface of polyimide resin layer and method for producing metal-clad laminate |
abstract | The present invention relates to a surface treatment method for a polyimide resin layer and a method for producing a metal-clad laminate that can cope with ultrathinning of an insulating resin layer while ensuring sufficient adhesive strength to meet the fine pitch of printed circuit boards. The surface treatment method for the polyimide resin layer includes a step of modifying the surface of the polyimide resin layer with an alkaline aqueous solution, and a polarity containing an amino compound such as an aromatic amino compound or diaminosiloxane on the modified surface of the polyimide resin layer. It has the process of apply | coating and drying a solution and forming the process layer of an amino compound. Furthermore, the process of imidating the process layer of the amino compound of this polyimide resin layer is provided. Moreover, a metal-clad laminate is obtained by thermocompression bonding or metal deposition of a metal foil on the surface-treated polyimide resin layer. Also, a polyimide resin laminate is obtained by thermocompression bonding of two surface-treated polyimide resin layers. |
priorityDate | 2006-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 222.