| abstract |
For rolled copper or copper alloy foil, copper sulfate (Cu conversion: 1 to 50 g / L), sulfuric acid: 1 to 150 g / L, as additives, one or two selected from sodium octyl sulfate, sodium decyl sulfate, sodium dodecyl sulfate Using a plating bath to which seeds or more are added, a roughened surface comprising copper fine particles, characterized by roughening plating under conditions of temperature: 20 to 50 ° C. and current density: 10 to 100 A / dm 2 Rolled copper or copper alloy foil provided. The present invention provides a roughened rolled copper or copper alloy foil having reduced craters, which is a significant drawback peculiar to rolled copper or copper alloy foil having a roughened surface, and has high strength and adhesion to a resin layer. Rolled copper suitable for flexible printed circuit boards that have strength, acid resistance and tin plating solution resistance, high peel strength, good etchability and gloss, and can be used for fine patterning of wiring Alternatively, a copper alloy foil and a roughening method thereof are provided. |