| abstract |
Resin containing polyamic acid and / or polyimide as a resin composition for sealing filler that does not induce electrode corrosion of a printed circuit board in a continuous voltage application test under high temperature and high humidity and has good stability at room temperature Use the composition. The polyamic acid has the following general formula (1): [Chemical 1] (In formula (1), Ar 1 represents a tetravalent organic group, Ar 2 represents a divalent organic group, and l is an integer of 1 or more.) The following general formula (2): [Chemical formula 2] (In formula (2), Ar 3 represents a tetravalent organic group, Ar 4 is a divalent organic group, and m is an integer of 1 or more). |