| abstract |
In particular, a photosensitive resin composition and a resin film obtained using the photosensitive resin, which are useful as buffer coating materials for LSI chips, are provided. For this purpose, a polycondensate obtained by polycondensing a compound represented by a specific chemical formula at a specific mixing ratio: 100 parts by weight, a photopolymerization initiator: 0.01 to 5 parts by weight, and a specific A photosensitive resin composition containing 1 to 30 parts by weight of an organic silane, and a resin film obtained by applying, exposing, developing, and curing the photosensitive resin composition on a silicon wafer surface are used. |