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filingDate 2006-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2007080701-A1
titleOfInvention Aluminum-silicon carbide composite and heat dissipation component using the same
abstract Provided is an aluminum-silicon carbide composite suitable as a base plate for a power module. An aluminum-silicon carbide composite obtained by impregnating a flat silicon carbide based porous material with a metal containing aluminum as a main component, and having an aluminum layer made of a metal containing aluminum as a main component only on one main surface. In addition, the back surface, which is the other main surface, has an aluminum-silicon carbide composite exposed, and the shape thereof is a rectangle or a rectangle with a portion surrounding a hole in the outer peripheral portion added thereto. Base plate for power module. By providing an aluminum layer on one main surface, plating properties are imparted, and the back surface is ground to improve the flatness by exposing the aluminum-silicon carbide composite, and the thickness of the aluminum layer is further increased. By controlling, the warp shape after grinding the back surface is controlled.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012044040-A
priorityDate 2006-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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