http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007074734-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2006-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2007074734-A1 |
| titleOfInvention | Abrasive-free polishing liquid and CMP polishing method |
| abstract | A CMP polishing liquid used by mixing with an oxidizing agent during polishing, comprising a copper rust inhibitor, a water-soluble polymer, a pH adjuster and water, and substantially free of abrasive grains, The dishing in the chemical polishing of copper is effectively suppressed, and a highly reliable wiring is formed. The content of the rust inhibitor, the water-soluble polymer and the oxidizing agent is 0.1 to 5% by weight, 0.05 to 5% by weight and 0.01 to 5M per liter of the CMP polishing liquid, The composition of the pH adjusting agent is preferably an amount necessary for adjusting the pH of the CMP polishing liquid to 1.5 to 2.5. |
| priorityDate | 2005-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.