http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007043333-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-36 |
| filingDate | 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2007043333-A1 |
| titleOfInvention | Electroless nickel plating solution |
| abstract | An object of the present invention is to provide an electroless nickel plating solution capable of forming an under barrier metal for metal bumps or solder bumps by electroless nickel plating on a silicon wafer composed of a large number of IC chips with a uniform film thickness. . In an electroless nickel plating solution containing a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, lead ions are 0.01 to 1 ppm, cobalt ions are 0.01 to 1 ppm, and sulfur compounds are 0.01. Electroless nickel plating solution containing ~ 1ppm. |
| priorityDate | 2005-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.