http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007037206-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D265-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 |
filingDate | 2006-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2009-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2007037206-A1 |
titleOfInvention | Thermosetting resin, thermosetting composition containing the same, and molded product obtained therefrom |
abstract | An object of this invention is to provide the thermosetting resin excellent in dielectric characteristics and heat resistance, the thermosetting composition containing the same, the molded object obtained from it, the board | substrate material for electronic devices, etc. The present invention relates to a thermosetting resin represented by the following general formula (I) having a dihydrobenzoxazine ring structure in the main chain, a thermosetting composition containing the same, and a molded product obtained from the thermosetting resin and an electronic device Substrate materials etc. are provided. [In the formula (I), Ar1 represents a tetravalent aromatic group, R1 represents a hydrocarbon group having a condensed alicyclic structure, and n represents an integer of 2 to 500. ] |
priorityDate | 2005-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 183.