| abstract |
A semiconductor chip (12) provided with a plurality of electrode terminals (16, 18), a sheet-like substrate (20) having at least a film capacitor, and electrode terminals (16, 18) of the semiconductor chip (12) on one surface. ) Arranged in correspondence with the chip connection terminals (36a, 36b) and one electrode terminal (28c) of the film capacitor on the sheet-like substrate (20), and the other ground terminal (36c). A mounting board (32) having an external connection terminal connected to the chip connection terminals (36a, 36b) and the ground terminal (36c) on the surface and mounted on the external board is provided. |